Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

How 3D multi-die design is accelerating AI chip design. How standards like UCIe are helping this task. You can send press releases for new products for possible coverage on the website. I am also ...

Researchers used 3D printing and capillary action to create customizable neural chips, expanding design freedom for brain research, biosensors and biocomputing. (Nanowerk News) Cultured neural tissues ...

Human intelligence and our collective wisdom are already becoming limiting factors in the rise of AI. Indeed, the only smart move at this point seems to be letting AIs design their own future hardware ...

Since their early introduction a few years ago, AI-powered features have become a mainstay of EDA (Electronic Design Automation) tools. Many of the complex yet potentially tedious tasks silicon ...