SlimCell(TM) ECP System's Individual-Cell Chemistry Enables Industry's First Multi-Step Copper Plating Capability for 65nm and Beyond Copper Chips Applied Materials, Inc. introduces its 300mm SlimCell ...
KALISPELL, Mont., Oct. 15, 2019 /PRNewswire/ -- Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice ® S8 electroplating system to MicroLink Devices, a ...
Applied Materials, Inc. introduces its 300mm SlimCell(TM) electrochemical plating (ECP) system that overcomes the limitations of existing plating technology to deliver a cost-effective, ...
The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
FREMONT, Calif., May 06, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
FREUDENSTADT, Germany, Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a leading global provider of equipment and solutions for the electronics industry, today announced the shipment of ...
SAN FRANCISCO — During the Semicon West trade show here, fab tool vendor Novellus Systems Inc. has rolled out a new electroplating system for the wafer-level packaging (WLP) market. Based on Novellus’ ...
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