Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

Onto has received multiple orders in support of high bandwidth memory (HBM), advanced logic and a variety of specialty segments WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) ...

Researchers from Zhejiang University in China have investigated the impact of impurities and defects on the performance of solar cells built with mono cast silicon (CM-Si) wafers and have found that ...

Photo-induced force microscopy (PiFM) offers nanoscale defect characterization in semiconductors, combining chemical ...

Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure Automated features enhance efficiency, but ...

Following its acquisition of Candela Instruments, KLA-Tencor (www.kla-tencor.com) has introduced the Candela CS20, an automated wafer inspection system designed to address the defect management ...

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...

Semiconductor fabrication facilities risk substantial financial exposure from incoming wafers defects. With typical lot sizes of 25 wafers and finished wafer values ranging from $4,000 to $17,000, ...

Researchers in quantum mechanics believe they’ve found a standard way to assess the viability of quantum memory in silicon chips — meaning existing components can be used as the fabric for a future ...