PALO ALTO, Calif., Aug. 4, 2025 — Broadcom Inc. (NASDAQ: AVGO), a semiconductor and infrastructure software company, today announced it is now shipping the Jericho4 ethernet fabric router — a platform ...
If your “microservices” still deploy like a monolith, maybe it’s time to break free with a truly composable AWS architecture.
This collaboration brings together carrier-neutral interconnection, modular AI infrastructure, and QumulusAI's GPU-as-a-Service platform into a repeatable, scalable national architecture purpose-built ...
MemryX has now signed an agreement with a next-generation 3D memory partner to execute a dedicated 2026 test chip program, validating a targeted 5um-class hybrid-bonded interface and direct-to-tile ...
PALO ALTO, Calif., Aug. 22, 2025 (GLOBE NEWSWIRE) -- Hot Chips -- NVIDIA (NVDA) today announced NVIDIA ® Spectrum-XGS Ethernet, a scale-across technology for combining distributed data centers into ...
The explosion of AI companies has pushed demand for computing power to new extremes, and companies like CoreWeave, Together AI and Lambda Labs have capitalized on that demand, attracting immense ...
Siemens and nVent are collaborating to develop a liquid cooling and power reference architecture for hyperscale AI workloads. The new joint architecture developed by Siemens and nVent is designed to ...
The rapid expansion of AI is creating significant strain on global energy grids, leading to substantial delays in bringing new data centers online due to insufficient grid capacity. Distributed energy ...
Modular, behind-the-meter power generation solutions are gaining traction among data center developers looking to bypass regulatory and interconnection hurdles. In an Oct. 22 note to clients, analysts ...
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