“Although DRAM capacity and bandwidth have increased sharply by the advances in technology and standards, its latency and energy per access have remained almost constant in recent generations. The ...

We first uncover the size, structure, and operation of DRAM subarrays and verify our findings on the characteristics of DRAM. Then, we correct misunderstood information related to AIBs and demonstrate ...

Tokyo – Toshiba Corp. has developed a new cell structure for embedded DRAM on silicon-on-insulator wafers that takes advantage of SOI's specific characteristics. The cell will be an essential ...

TOKYO — Toshiba Corp. said it is leveraging its deep-trench-capacitor DRAM structure, which it has championed as a process driver since the 0.25-micron generation, to migrate its system-on-chip ...

TL;DR: SK hynix unveiled a 30-year DRAM roadmap featuring 4F2 Vertical Gate and 3D DRAM technologies to enhance performance, integration, and power efficiency beyond 10nm scales. These innovations aim ...

What just happened? A Californian company is launching what it calls a ground-breaking solution for increasing DRAM chip density with 3D stacking technology. The new memory chips will greatly improve ...

Any attempt to truly push the future of computing means fundamentally redesigning memory -- but after 40 years, can DRAM be easily swept aside? Share on Facebook (opens in a new window) Share on X ...

On June 4, 1968, Robert Dennard was granted a patent for a single transistor, single capacitor DRAM cell design idea. This doesn’t sound earth-shattering today, but back in the sixties, this was a ...

VCT (vertical channel transistor) DRAM is one of the first achievements towards this goal, with Samsung expected to complete the initial development of VCT DRAM in 2025, with 3D DRAM hitting the ...

Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize the memory industry as we know it today. Neo estimates that its 3D X-DRAM ...

CEO Andy Hsu will introduce new applications and variations for 3D NAND flash and 3D DRAM, including a new AI application called "Local Computing", drastically increasing AI chip performance to a new ...