SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
A technical paper titled “Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin” was published by researchers at Delft University of Technology and NXP ...
The SP1012 series TVS diode array is the most densely designed ESD protection device on the market today. It packs five ESD diodes in a 0402-size (0.94 x 0.61-mm) flip-chip package that would normally ...
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