KAOHSIUNG, Sept. 1, 2024 /PRNewswire/ -- E&R Engineering Corp. (8027.TWO) hosted an event on August 28, 2024, in Taipei, Taiwan, where they launched the "E-Core System." This initiative, a combination ...

KAOHSIUNG, Oct. 23, 2023 /PRNewswire/ -- On September 19, 2023, Intel announced one of the industry's first glass substrates for next-generation advanced packaging. The industry believes that glass ...

China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in yield and process ...

HSINCHU, June 17, 2025 /PRNewswire/ -- Professional semiconductor equipment provider Spirox Corporation (TWSE: 3055) has introduced the industry-first SpiroxLTS (Spirox Laser Tomography Scanning) ...

The semiconductor industry is a land of peaks and valleys. It’s a place where each innovation represents the culmination of a long and often difficult climb to the summit. In the case of glass ...

SEOUL, South Korea, July 14, 2025 /PRNewswire/ -- JNTC Co., Ltd. (KOSDAQ: 204270), a leading advanced materials company, hosted a product launch on June 30 at the Korea Exchange Conference Hall, ...

The drive for increased performance is enticing some advanced packaging manufacturers to transition from traditional organic substrates to glass core substrates, a switch that comes with numerous ...

Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling its move into ...

Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

As commercialization of glass substrates, considered a core technology for next‑generation semiconductor packaging, approaches, SK, LG, Samsung and others are rapidly expanding partnerships with ...