SAN FRANCISCO — The semiconductor industry's battle with design-for-manufacturing (DFM) challenges is currently focused predominately on the resolution enhancement technology (RET) front, with EDA ...
SANTA CLARA, Calif. — During the BACUS Symposium in Monterey next week, ASML MaskTools will unveil a software product that enables the creation of advanced photomasks for the nanometer era. The ...
VELDHOVEN, The Netherlands--(BUSINESS WIRE)--Brion Technologies, a division of ASML, today announced a new product for its popular Tachyon computational lithography platform. Tachyon MB-SRAF ...
Calling OPC Unified Architecture (OPC-UA or UA) from Scottsdale, Ariz.-based OPC Foundation (www.opcfoundation.org) “very scalable,” Jeff Harding identifies two principal features that make it a ...
OPC UA including APL, TSN, and 5G for the field: The Field Level Communications initiative reaches a major milestone. Figure 1. FLC initiative developing extensions to the OPC UA framework for field ...
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