The rapid development of advanced optical technology has driven a strong demand for high-dimensional laser field manipulation, where the ability to tailor multiple degrees of freedom (DoFs) on-demand ...
Technological advances have vastly expanded the amount of omic data currently available. Historically, each type of data was analysed separately, although approaches to integrate omic data sets to ...
New research paper titled “Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)” from researchers at Tokyo ...
The semiconductors industry is expected to be revolutionized by two-dimensional materials. Still, while multiple studies have noted prototype devices comprising hopeful properties for driving and ...
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