As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology-leading ...

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The ...

Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing its smart ...

As competition in high bandwidth memory (HBM) to boost artificial intelligence (AI) semiconductor performance intensifies, the core task has shifted from how small to make memory to how precisely to ...

AUSTIN, Texas — LSI Logic Corp. has developed a form of wire bond packaging that places the bonding pads directly on top of the active I/O circuitry on the silicon. The move could extend the reach and ...

As solder bump pitches shrink, several issues arise. Reduced bump height and surface area for bonding make it increasingly difficult to establish reliable electrical connections, necessitating precise ...