With rising transport costs and dimensional pricing, packaging now directly drives logistics spend rather than being a ...

Demands for lower-cost, higher-density, and smaller-footprint ICs aimed at portable electronics make 3D-packaging designers sweat. The push for 3D packaging of semiconductor ICs directly results from ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Dr. Steen Tjarks is the CEO at T&T Design, a global packaging and artwork agency that specializes in private label. Private-label products have seen significant growth globally, and I see packaging ...