The power electronics industry and the semiconductor industry, inseparably intertwined with one another, are facing unprecedented efficiency, cost, construction and thermal challenges which provide ...

Laser Tek, which mainly produces SMD (surface-mount-device) packaging materials for passive components, has reported an 8.3% sequential drop in consolidated revenues to NT$154 million... Wednesday 10 ...

Customers are pushing for increasing power per board and implementing ever more silicon on the PCB with the result that increasing processing density in high-end server designs will continue to have ...

(MENAFN- Meridian Market Consultants) In an era where the global supply chain is more interconnected than ever, the demand for efficient temperature-controlled packaging solutions has reached ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

Laser Tek, a major supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment in Taiwan, yesterday announced that it will enter back-end production for passive components.

The passive temperature-controlled packaging solutions market is experiencing robust growth driven by the increasing need for temperature-sensitive transportation in industries such as pharmaceuticals ...

According to the latest analysis by Future Market Insights (FMI), the global passive temperature-controlled packaging solutions market is poised for significant growth, with an estimated value of US$ ...

RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.