Paras Defence launched Paras Semiconductor to set up advanced heterogeneous & 3D chip packaging, strengthening India’s ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

New subsidiary to focus on advanced semiconductor packaging for defence and strategic electronics – Paras would be setting up India’s first advanced heterogeneous & 3D packaging ...

Paras Defence and Space Technologies Ltd. on Monday announced the launch of a new subsidiary, Paras Semiconductor Pvt. Ltd., marking its entry into the semiconductor segment with a focus on advanced ...

Dublin, Jan. 09, 2018 (GLOBE NEWSWIRE) -- The "High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends" report has been added to Research and Markets' offering. The ...

Advanced Semiconductor Engineering (ASE) initiated volume production of Sandwich SCSP (stacked die chip-scale package) and SiP (system-in-a-package) products in the first quarter and is now hoping to ...