1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

The OSD335x C-SiP hits the size and performance sweet spot for a wide range of applications, from building automation to industrial control to consumer goods, and it’s going to be especially popular ...

System-on-module (SOM) and system-in-package (SIP) solutions were out in force at this year’s Embedded World. These cost a bit more than trying to put comparable logic down on a printed circuit board ...

System-in-packages Also aimed at robotics and IoT projects with Qualcomm SoCs, Lantronix Inc. introduced a new Open-Q family of SIP modules at embedded world. These include the entry-level Open-Q ...

At Embedded World North America, Octavo Systems co-founder Gene Frantz and CTO Erik Welsh discussed the company’s focus on system-in-package (SiP) technologies and their role in embedded systems.