Electronic Design

Selecting Die Attach Technology for High-Power Applications

High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the ...
Business Wire

StratEdge Offers Assembly Services for Die Attachment on CMC Tabs

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave ...
Semiconductor Engineering

Home Win: Challenging The Traditional Semiconductor Manufacturing Model

Amid rising supply chain risk and geopolitical uncertainty, attention is turning to regional capability as the semiconductor ...
AZOM

Indium Corporation Introduces Au-Based Precision Die-Attach Preforms

Indium Corporation ® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of ...
Business Wire

Global Semiconductor Assembly Equipment Market Driven by the Increasing Adoption of Advanced Packaging Techniques: Technavio

LONDON--(BUSINESS WIRE)--According to the latest market study released by Technavio, the global semiconductor assembly equipment market is projected to grow to USD 5.04 billion by 2021, at a CAGR of ...