At a memory conference this week, semiconductor giant Samsung updated its roadmap with several ambitious technologies. Those include 3D DRAM and stacked DRAM, which it says could arrive this decade.

Samsung has just unveiled its next-generation 3D DRAM technology for next-generation memory solutions, with a single-chip capacity of over 100GB, a massive leap over current limitations in DRAM ...

HBM has become one of the most successful and widely adopted examples of chiplet-based integration in AI systems.

TL;DR: NVIDIA envisions the future of AI compute with innovations like silicon photonics interposers, 3D stacked DRAM, and GPU tiers. The approach includes module-level cooling, die-to-die electrical ...

Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron. According to reports from TheElec and ZDNet Korea, citing industry sources, ...

Samsung Electronics has set its sights on becoming the frontrunner in the emerging field of 3D DRAM memory, according to a report from Semiconductor Engineering. This announcement, made at the Memcon ...

Something to look forward to: The memory industry is known for its conservative approach, often favoring incremental improvements over revolutionary changes. But as we look toward the end of the ...

D-Matrix shifts focus from AI training to inference hardware innovation The Corsair uses LPDDR5 and SRAM to cut HBM reliance Pavehawk combines stacked DRAM and logic for lower latency Sandisk and SK ...

The transition to high-definition digital television and the consumer push toward ever-larger and higher-resolution flat-panel displays have introduced new challenges for OEMs and systems integrators.