The simulation tracks a satellite's surface and internal temperature changes as it orbits Earth, considering varying thermal inputs from sunlight and Earth's shadow. Monte Carlo radiation modeling ...

Today's device-packaging technologies force thermal assessment. Device makers and software vendors join forces to provide workable options. Electrical and thermal systems share much in common. Getting ...

Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...

The Computational Fluid Dynamics (CFD) modeling of light emitting diode (LED) components has become increasingly more important as it is now being applied to the design process. This paper compares ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

The electronics industry exists in a continuous state of evolution. The world’s biggest companies are either launching new products, or refining and improving existing ones. In keeping with consumer ...

Under funding from NASA’s Earth Science Technology Office (ESTO), Leonardo DRS developed and flight-tested a six-band thermal sensor to demonstrate its potential utility as a low-cost space-bourne ...

Download this article in PDF format. The next generation of vehicles will generate, process, and communicate much more data than current vehicles. Wireless networking via mobile technologies (e.g., 5G ...

The exterior conceals new technology behind the bezels that make possible such features as adaptive beams and LED matrix beams, for example. Often, each LED has its own lens that is held by a fixture, ...