Toshiba America Electronic Components Inc. (TAEC) has announced TSSOP Advance, a new smaller packaging technology that extends the company's diverse packaging options for power MOSFETs. Developed by ...
Dual Synchronous PWM Controller and LDO Controller in TSSOP Package Eases Multi-Output and Two-Phase
Many applications like DDR memory, and set top boxes require at least two output voltages. And then there are some others such as graphics cards where the output power exceeds any single input power ...
This application note provides the PCB design and SMT assembly guidelines for Maxim Integrated’s leaded packages (SOIC, TSSOP, QSOP, QFP, SC70, SOP, SOT, etc.). Leaded packages are surface-mount ...
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