Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...
Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...
Improving on product overlay is one of the key challenges when shrinking technology nodes in semiconductor manufacturing. . . . With smart placement of alignment mark pairs in the X and Y direction, ...
Olympus Integrated Technologies America presented its 3D-ICautomated metrology system at SEMICON West 2010. The system provides preciseimaging to verify the alignment of bonded wafers and TSVs ...
Silicon photonics is one of the key emerging technologies addressing growing internet traffic and demand for higher data rate. Silicon photonics’ primary applications are in the data center market, ...
One of the contributors to layer-to-layer overlay in today’s chip manufacturing process is wafer distortion due to thin film deposition. Mismatch in the film specific material parameters (e.g., ...
The solar industry must work together to agree on standardised larger wafer sizes, according to monocrystalline solar manufacturer LONGi Group. The company has revealed that its H-MO4 module, which ...
SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to ...
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