Taiwanese semiconductor wafer probe card maker WinWay Technology has entered a long-term supply agreement with Italy's Technoprobe, a leading probe card manufacturer, and Greater China distributor MS ...

During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...

Wafer probe, one of the key processes for ensuring reliability in semiconductor manufacturing, is becoming increasingly unreliable in multi-die assemblies and at leading-edge nodes. For much of the ...

Employees wear smocks and safety gear inside a cleanroom at Texas Instruments' new semiconductor wafer plant, Wednesday, Dec. 17, 2025, in Sherman. Chitose Suzuki / Staff Photographer Texas ...

The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...

On-wafer probing techniques have become indispensable in the precise characterisation of semiconductor devices operating in the microwave and terahertz regions. These techniques enable the direct ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

Sponsored by Vitrek, LLCReviewed by Maria OsipovaSep 18 2025 Wafer lapping is a vital semiconductor thinning operation that requires precise control to avoid over-removal of material, which can result ...