In traditional semiconductor packaging, manual defect review after automated optical inspection (AOI) is an arduous task for operators and engineers, involving review of both good and bad die. It is ...

SANTA CLARA, Calif.– Applied Materials Inc. here today introduced its latest tool for use in imaging and analyzing wafer defects as small as 80-nm. The SEMVision G2 tool from Applied uses a ...

Optical 3D metrology enables fast, non-contact surface roughness measurement of defects and roughness for precise ...

San Francisco, CA. KLA-Tencor chose SEMICON West to highlight six new wafer-defect inspection and review systems for leading-edge IC device manufacturing: the 3900 Series (previously referred to as ...