Miniaturization and power efficiency have long defined sensor designs. Enter artificial intelligence (AI) and software ...

Mitsubishi announced that it has begun shipping samples of two S1-Series high-voltage IGBT modules rated at 1.7 kV.

HaiLa Technologies has introduced the EVAL2000 development board, featuring its BSC2000 passive backscatter Wi-Fi chip and ST ...

Synaptics is pairing Google’s ML core with its Astra AI-native hardware and open-source software to simplify IoT device ...

Processing-in-memory (PiM), a silver bullet for TinyML, is just one tool to execute SLMs and some LLMs effectively at the far ...

TI’s automotive SoC releases for CES 2025 this year: a radar sensor for passenger safety, new audio processor solutions, and ...

Heat shrink tubing, rarely referred to simply as “HST” even in our acronym-intensive world, is made of cross-linked polymers ...

Canyon Bridge has hired Lazard Inc. to seek a buyer for British graphics chip designer Imagination Technologies.

Flat-membrane speaker drivers could be acoustically superior to cone-shaped ones, but relying on theoretical benefits isn’t always a safe bet.

According to a report published in Economic Daily News, TSMC has successfully integrated CPO with advanced semiconductor ...

A year ago in his 2023 retrospective intro, our engineer referenced one of his favorite sayings, “the only constant is change ...

The SDV roadmaps from automotive OEMs, Tier 1's, chip vendors, and software suppliers at CES 2025 will provide visibility on ...