
Homepage | Besi
BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets …
Company | Besi
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of …
BE Semiconductor Industries N.V. Announces Q4-25 and Full
6 days ago · Duiven, the Netherlands, February 19, 2026 - BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of …
Company Profile - Besi
Besi is a global company with headquarters in Duiven, the Netherlands. It operates eight facilities in Asia and Europe for development and production activities, as well as 13 sales and service offices across …
Products & Technology - Besi
Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile …
Investor Relations - Besi
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of …
Press Releases - Besi
Duiven, the Netherlands, February 12, 2026 - BE Semiconductor Industries N.V. (“the Company” or "Besi"), (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment …
Company Overview - Besi
Besi Switzerland, based in Steinhausen, Switzerland, is a leader in the production of epoxy, flip chip and soft solder die bonding systems for the assembly equipment market.
Jobs - Besi
Besi employees are part of a global multinational team striving to realize tomorrow's technologies and opportunities in the fast paced world of semiconductor equipment manufacturing. Set forth below are …
Products & Technology | Besi
Besi offers a wide range of die attach systems based on leading-edge technology. The offering includes multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip …