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15:18
CNBC
Katie Tarasov
TSMC scrambles to bring advanced packaging to the U.S. as demand soars from the AI boom
There's a new bottleneck in AI chipmaking that almost all happens in Asia right now: advanced packaging. It connects smaller chips together into a larger chip like a GPU. As Nvidia books the majority of capacity, TSMC is building its first U.S. packaging plants and Elon Musk taps Intel for custom chip plans in Texas. CNBC got an exclusive ...
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